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june 2009 doc id 7505 rev 6 1/11 11 stps3l60 power schottky rectifier features negligible switching losses low forward voltage drop avalanche capability specified description axial and surface mount power schottky rectifier suited for switch mode power supplies and high frequency dc to dc converters. packaged in do-201ad, do-15, smb and smbflat, this device is intended for use in low voltage, high frequency inverters and small battery chargers and for applications where there are space constraints, for example telecom battery charger. table 1. device summary i f(av) 3 a v rrm 60 v t j (max) 150 c v f (max) 0.61 v k a k a k a k a smb stps3l60u do-201ad stps3l60 do-15 stps3l60q smbflat STPS3L60UF www.st.com
characteristics stps3l60 2/11 doc id 7505 rev 6 1 characteristics table 2. absolute ratings (1) 1. limiting values, per diode symbol parameter value unit v rrm repetitive peak reverse voltage 60 v i f(rms) rms forward current 10 a i f(av) average forward current t l = 105 c = 0.5 (do-201ad, smb) 3a t l = 72 c = 0.5 (do-15) t l = 127 c = 0.5 (smbflat) i fsm surge non repetitive forward current t p = 10 ms sinusoidal 100 a p arm repetitive peak avalanche power t p = 1 s t j = 25 c 2000 w t stg storage temperature range -65 to + 150 c t j maximum operating junction temperature (2) 2. condition to avoid thermal runaway for a diode on its own heatsink 150 c dv/dt critical rate of rise reverse voltage 10000 v/s table 3. thermal resistance symbol parameter value unit r th (j-l) junction to leads smbflat 10 c/w smb 20 lead length = 10 mm do-201ad 20 do-15 35 dptot dtj --------------- 1 rth j a ? () ------------------------- - <
stps3l60 characteristics doc id 7505 rev 6 3/11 to evaluate the conduction losses use the following equation : p = 0.44 x i f(av) + 0.05 x i f 2 (rms) table 4. static electrical characteristics symbol parameter tests conditions min. typ. max. unit i r (1) 1. pulse test :t p = 380 s, < 2% reverse leakage current t j = 25 c v r = v rrm --150 a t j = 100 c -415 ma t j = 125 c -1430 v f (1) forward voltage drop t j = 25 c i f = 3 a --0.62 v t j = 100 c -0.530.61 t j = 125 c -0.510.59 t j = 25 c i f = 6 a --0.79 t j = 100 c -0.620.71 t j = 125 c -0.60.69 figure 1. average forward power dissipation versus average forward current figure 2. average forward current versus ambient temperature ( = 0.5) (do-201ad, smb) p (w) f(av) 0.00 0.25 0.50 0.75 1.00 1.25 1.50 1.75 2.00 2.25 2.50 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 t =tp/t tp i (a) f(av) = 0.05 = 0.1 = 0.2 = 0.5 = 1 i (a) f(av) 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 0 25 50 75 100 125 150 r =80c/w th(j-a) r=r th(j-a) th(j-i) t (c) amb
characteristics stps3l60 4/11 doc id 7505 rev 6 figure 3. average forward current versus ambient temperature ( = 0.5) (do-15) figure 4. average forward current versus ambient temperature ( = 0.5) (smbflat) i (a) f(av) 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 0 25 50 75 100 125 150 rth(j-a)=rth(j-l) rth(j-a)=100c/w t (c) amb 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 0 25 50 75 100 125 150 rth(j-a)=rth(j-l) rth(j-a)=100c/w i (a) f(av) t (c) amb figure 5. normalized avalanche power derating versus pulse duration figure 6. normalized avalanche power derating versus junction temperature 0.001 0.01 0.1 0.01 1 0.1 10 100 1000 1 t (s) p p(t p ) p (1 s) arm arm 0 0.2 0.4 0.6 0.8 1 1.2 25 50 75 100 125 150 t (c) j p(t j ) p (25 c) arm arm figure 7. non repetitive surge peak forward current versus overload duration (maximum values) (do-201ad) figure 8. non repetitive surge peak forward current versus overload duration (maximum values) (do-15) i (a) m 0 2 4 6 8 10 12 1.e-03 1.e-02 1.e-01 1.e+00 ta=25 c ta=50 c ta=100 c i m t =0.5 t(s) 0 1 2 3 4 5 6 7 8 9 10 11 1.e-03 1.e-02 1.e-01 1.e+00 ta=25 c ta=50 c ta=100 c i m t =0.5 i (a) m t(s)
stps3l60 characteristics doc id 7505 rev 6 5/11 figure 9. non repetitive surge peak forward current versus overload duration (maximum values) (smb) figure 10. non repetitive surge peak forward current versus overload duration (maximum values) (smbflat) 0 1 2 3 4 5 6 7 8 9 10 11 1.e-03 1.e-02 1.e-01 1.e+00 ta=25 c ta=50 c ta=100 c i m t =0.5 i (a) m t(s) 0 5 10 15 20 25 30 35 40 1.e-03 1.e-02 1.e-01 1.e+00 t l =25c t l =50c t l =100c i m t =0.5 i (a) m t(s) figure 11. relative variation of thermal impedance junction to ambient versus pulse duration (do-201ad) figure 12. relative variation of thermal impedance junction to ambient versus pulse duration (do-15) 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.e-01 1.e+00 1.e+01 1.e+02 1.e+03 single pulse z/r th(j-a) th(j-a) t (s) p 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.e-01 1.e+00 1.e+01 1.e+02 1.e+03 single pulse z/r th(j-a) th(j-a) t (s) p figure 13. relative variation of thermal impedance junction to ambient versus pulse duration (smb) figure 14. relative variation of thermal impedance junction to lead versus pulse duration (smbflat) 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.e-01 1.e+00 1.e+01 1.e+02 1.e+03 single pulse z/r th(j-a) th(j-a) t (s) p 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.e-03 1.e-02 1.e-01 1.e+00 single pulse z/r th(j-l) th(j-l) t (s) p
characteristics stps3l60 6/11 doc id 7505 rev 6 figure 15. reverse leakage current versus reverse voltage applied (typical values) figure 16. junction capacitance versus reverse voltage applied (typical values) 1.e-03 1.e-02 1.e-01 1.e+00 1.e+01 1.e+02 0 5 10 15 20 25 30 35 40 45 50 55 60 tj=125c tj=25c tj=100c v (v) r i (ma) r 10 100 1000 1 10 100 f=1mhz vosc=30mv tj=25c v (v) r c(pf) figure 17. forward voltage drop versus forward current (high level) figure 18. forward voltage drop versus forward current (low level) 0 5 10 15 20 25 30 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 tj=25c (maximum values) tj=100c (maximum values) tj=100c (maximum values) tj=100c (typical values) tj=100c (typical values) i (a) fm v (v) fm 0 1 2 3 4 5 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 tj=25c (maximum values) tj=100c (maximum values) tj=100c (maximum values) tj=100c (typical values) tj=100c (typical values) i (a) fm v (v) fm figure 19. thermal resistance junction to ambient versus copper surface under each lead (smb) figure 20. thermal resistance junction to ambient versus copper surface under each lead (smbflat) 0 20 40 60 80 100 120 0 . 00 . 5 1. 0 1. 5 2. 0 2. 53 . 03 . 5 4. 0 4. 55 . 0 smb s(cu)(cm2) r (c/w) th(j-a) copper thickness = 35 m expoxy printed circuit fr4, 0 20 40 60 80 100 120 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 smb-flat s(cu)(cm2) r (c/w) th(j-a) copper thickness = 35 m expoxy printed circuit fr4,
stps3l60 package information doc id 7505 rev 6 7/11 2 package information epoxy meets ul94,v0 in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions and product status are available at: www.st.com . ecopack ? is an st trademark. figure 21. do-15 plastic dimensions ref. dimensions millimeters inches min. max. min. max. a 6.05 6.75 0.238 0.266 b 2.95 3.53 0.116 0.139 c 26 31 1.024 1.220 d 0.71 0.88 0.028 0.035 figure 22. do-201ad plastic dimensions ref. dimensions millimeters inches min. max. min. max. a 9.50 0.374 b 25.40 1.000 ? c 5.30 0.209 ? d 1.30 0.051 e 1.25 0.049 notes: 1. the lead diameter ? d is not controlled over zone e 2. the minimum axial length within which the device may be placed with its leads bent at right angles is 0.59?(15 mm) d b a cc ?c ?d a ee note 2 note 1 note 1 bb
package information stps3l60 8/11 doc id 7505 rev 6 figure 23. smb footprint, dimensions in mm (inches) table 5. smb dimensions ref. dimensions millimeters inches min. max. min. max. a1 1.90 2.45 0.075 0.096 a2 0.05 0.20 0.002 0.008 b 1.95 2.20 0.077 0.087 c 0.15 0.40 0.006 0.016 d 3.30 3.95 0.130 0.156 e 5.10 5.60 0.201 0.220 e1 4.05 4.60 0.159 0.181 l 0.75 1.50 0.030 0.059 e c l e1 d a1 a2 b 2.60 5.84 1.62 2.18 1.62 (0.064) (0.102) (0.300) (0.064) (0.086)
stps3l60 package information doc id 7505 rev 6 9/11 figure 24. smbflat footprint dimensions (a) table 6. smbflat dimensions ref. dimensions millimeters inches min. typ. max. min. typ. max. a 0.90 1.10 0.035 0.043 b 1.95 2.20 0.077 0.087 c 0.15 0.40 0.006 0.016 d 3.30 3.95 0.130 0.156 e 5.10 5.60 0.200 0.220 e1 4.05 4.60 0.189 0.181 l 0.75 1.50 0.029 0.059 l1 0.40 0.016 l2 0.60 0.024 a. smb footprint may also be used. d a l 2x l l2 2x l1 2x e e1 b c 1.20 (0.047) 1.20 (0.047) 3.44 (0.136) 5.84 (0.230) 2.07 (0.082) millimeters (inches)
ordering information stps3l60 10/11 doc id 7505 rev 6 3 ordering information 4 revision history table 7. ordering information order codes marking package weight base qty delivery mode stps3l60 stps3l60 do-201ad 1.12 g 600 ammopack stps3l60rl stps3l60 do-201ad 1.12 g 1900 tape and reel stps3l60q stps3l60 do-15 0.4 g 1000 ammopack stps3l60qrl stps3l60 do-15 0.4 g 6000 tape and reel stps3l60u g36 smb 0.107 g 2500 tape and reel STPS3L60UF fg36 smbflat 0.136 g 5000 tape and reel table 8. document revision history date revision changes july-2003 5a previous issue 12-jun-2009 6 reformatted to current standards. added smbflat package. added ecopack statement. added cathode band graphics.
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